Shenyang Starlight Advanced Ceramics: A 30-Year Legacy Pioneering Silicon Carbide Transition to Semiconductor Frontiers

Shenyang Starlight Advanced Ceramics Co., Ltd., a trailblazer in silicon carbide manufacturing with three decades of expertise, is strategically transitioning from traditional kiln furniture production to semiconductor-grade solutions. Leveraging its deep-rooted technical prowess and global supply chain capabilities, the company is poised to redefine precision silicon carbide components for next-generation chip manufacturing.

From Kiln to Chip: A Strategic Evolution

Founded in 1995 as a Sino-German joint venture, Shenyang Starlight initially focused on industrial kiln components, earning recognition as a national high-tech enterprise and exporting products to over 20 countries . With the semiconductor silicon carbide market projected to exceed $10 billion by 2028, the company began diversifying in 2019 by establishing its advanced materials division, targeting high-purity silicon carbide structural parts for semiconductor equipment .

“Our shift aligns with China's push for semiconductor self-reliance,” said CEO Mr Xing. “silicon carbide's thermal stability and purity make it indispensable for etching, deposition, and wafer handling systems.”

Technological Breakthroughs Driving Transition

1. Ultra-High Purity Material Innovation

The company now produces 4N+ (99.99%) purity silicon carbide powders through proprietary refining processes, eliminating metallic impurities critical for contamination-sensitive semiconductor processes .

Multi-stage sintering (reaction-bonded, recrystallized, and hot-pressed) ensures density >3.1 g/cm³, meeting ASML and TEL specifications for vacuum compatibility .

2. Precision Manufacturing Capabilities

Advanced forming techniques, including isostatic pressing and 3D printing, enable complex geometries like wafer-handling robots and CVD chamber liners with ±0.01 mm tolerance .

Proprietary laser-assisted machining reduces subsurface damage by 60% compared to conventional grinding, crucial for <1 nm surface roughness in lithography stages .

3. Cross-Industry Synergy

Drawing from decades in kiln component R&D, the company adapted thermal shock-resistant designs (originally for ceramic sintering at 1,600°C) to semiconductor rapid thermal processing (RTP) systems, achieving 30% longer service life than quartz alternatives .

Semiconductor Product Portfolio

Wafer Carriers: Recrystallized silicon carbide trays for high-temperature diffusion furnaces, reducing particle generation by 50% versus alumina .

Vacuum Chucks: Low-outgassing silicon carbide electrostatic chucks with embedded cooling channels for EUV lithography systems.

Plasma-Resistant Components: Nitride-bonded silicon carbide shields for etch tools, validated in 500+ hour corrosive plasma tests .

Collaborative Ecosystem Building

1. Academic Partnerships: Co-developing quantum dot-enhanced silicon carbide coatings with Shenyang University to minimize wafer sticking in high-vacuum environments .

2. Industry Alliances: Joined the Liaoning Semiconductor Materials Consortium in 2024, sharing silicon carbide processing standards with SMIC and Naura .

3. Global Certification: Obtained SEMI S2 compliance in Q2 2025, paving the way for Tier 1 foundry approvals .

Challenges and Future Roadmap

While traditional kiln products still contribute 65% of revenue, the semiconductor division targets 40% growth annually through:

Capacity Expansion: Doubling isostatic pressing lines by Q3 2026 to meet 8-inch wafer tool demand.

AI-Driven Quality Control: Implementing machine vision for real-time defect detection during CNC machining.

Circular Economy: Recycling 95% of grinding slurry via patented filtration systems, aligning with ESG goals .

“Our 30-year journey mirrors China's manufacturing evolution,” noted CTO Zhang Wei. “From kiln shelves to chip fabs, we're writing silicon carbide's next chapter—one atomic layer at a time.”